070-4121-5539

사업분야

Assembly

MLPGA,LF Mold,Open Cavity,COB등 직접 Sample Assembly 하고 있습니다.

Assembly In-house

MLPGA PKG(Multi Land Plastic Grid Array)

JEDEC 규격의 L/F PKG를 Substrate(PCB)재질로 L/F PKG DEMENSION과 동일하게 제작하여 SMT를 할 수 있으며
초기 개발시 3~4일 내로 신속하게 대응 가능하도록 설계된 PKG입니다.

MLFBGA POD

*해당 POD를 누르면 Download됩니다.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLFBGA
12X12 180 1.51 1.26 0.80 POD-MLFBGA-12180 (12x12 180Ball 0.8Pitch)
12X12 264 1.51 1.26 0.65 POD-MLFBGA-12264 (12x12 264Ball 0.65Pitch)
12X12 448 1.51 1.26 0.50 POD-MLFBGA-12448 (12x12 448Ball 0.5Pitch)
14X14 400 1.51 1.26 0.65 POD-MLFBGA-14400(14x14 400Ball 0.65Pitch)
15X15 480 1.51 1.26 0.65 POD-MLFBGA-15484(15x15 484Ball 0.65Pitch)

MLQFN POD

*해당 POD를 누르면 Download됩니다.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLQFN
4x4 16 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0416 (4x4 16LD)
24 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0424 (4x4 24LD)
28 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0428 (4x4 28LD)
32 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0432 (4x4 32LD)
5X5 20 0.95/1.51 0.7/1.26 0.65 POD-MLQFN-0520 (5x5 20LD)
28 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0528 (5x5 28LD)
32 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0532 (5x5 32LD)
40 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0540 (5x5 40LD)
6X6 20 0.95/1.51 0.7/1.26 0.80 POD-MLQFN-0620 (6x6 20LD)
28 0.95/1.51 0.7/1.26 0.65 POD-MLQFN-0628 (6x6 28LD)
40 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0640 (6x6 40LD)
48 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0648 (6x6 48LD)
56 0.95/1.51 0.7/1.26 0.35 POD-MLQFN-0656 (6x6 56LD)
7X7 20 0.95/1.51 0.7/1.26 1.00 POD-MLQFN-0720 (7x7 20LD)
48 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0748 (7x7 48LD)
56 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0756 (7x7 56LD)
68 0.95/1.51 0.7/1.26 0.35 POD-MLQFN-0768 (7x7 68LD)
8X8 56 0.95/1.51 0.7/1.26 1.00 POD-MLQFN-0856 (8x8 56LD)
68 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0868 (8x8 68LD)
9X9 76 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0976 (9x9 76LD)
10X10 88 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-10088 (10x10 88LD)
11X11 100 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-11100 (11x11 100LD)
12X12 100 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-12100 (12x12 100LD)

MLDFN POD

*해당 POD를 누르면 Download됩니다.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLDFN
2X2 6 0.95 0.7 0.65 준비중
8 0.95 0.7 0.5 준비중
10 0.95 0.7 0.4 준비중
2X3 6 0.95 0.7 0.65 준비중
8 0.95 0.7 0.5 준비중
10 0.95 0.7 0.4 준비중
3X2 8 0.95 0.7 0.65 준비중
14 0.95 0.7 0.4 준비중
3X3 8 0.95 0.7 0.65 준비중
10 0.95 0.7 0.5 준비중
12 0.95 0.7 0.45 준비중

MLQFP POD

*해당 POD를 누르면 Download됩니다.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLQFP
7X7 32 0.95/1.51 0.7/1.26 0.80 POD-MLQFP-0732(7x7 32LD)
48 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-0748(7x7 48LD)
64 0.95/1.51 0.7/1.26 0.40 POD-MLQFP-0764(7x7 64LD)
10X10 52 0.95/1.51 0.7/1.26 0.65 POD-MLQFP-1052(10x10 52LD)
64 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-1064(10x10 64LD)
80 0.95/1.51 0.7/1.26 0.40 POD-MLQFP-1080(10x10 80LD)
14X14 64 0.95/1.51 0.7/1.26 0.80 POD-MLQFP-1464(14x14 64LD)
80 0.95/1.51 0.7/1.26 0.65 POD-MLQFP-1480(14x14 80LD)
100 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-14100(14x14 100LD)
128 0.95/1.51 0.7/1.26 0.40 POD-MLQFP-14128(14x14 128LD)
16X16 120 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-16120(16x16 120LD)
20X20 144 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-20144(20x20 144LD)
144 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-20144H(20x20 144LD Heat Sink)
176 0.95/1.51 0.7/1.26 0.40 POD-MLQFP-20176(20x20 176LD)
24X24 216 1.51 1.26 0.40 POD-MLQFP-24216(24x24 216LD)
28X28 208 1.51 1.26 0.50 POD-MLQFP-28208(28x28 208LD)
256 1.51 1.26 0.40 POD-MLQFP-28256(28x28 256LD)

MLSOP POD

*해당 POD를 누르면 Download됩니다.
pkg type body size lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLSOP
150MIL 8 1.51 1.26 1.27 POD-MLSOP-15008(8LD 150MIL)
14 1.51 1.26 1.27 POD-MLSOP-15014(14LD 150MIL)
16 1.51 1.26 1.27 POD-MLSOP-15016(16LD 150MIL)
300MIL 16 1.51 1.26 1.27 POD-MLSOP-30016(16LD 300MIL)
20 1.51 1.26 1.27 POD-MLSOP-30020(20LD 300MIL)
24 1.51 1.26 1.27 POD-MLSOP-30024(24LD 300MIL)
28 1.51 1.26 1.27 POD-MLSOP-30028(28LD 300MIL)
32 1.51 1.26 1.27 POD-MLSOP-30032(32LD 300MIL)

MLSSOP POD

*해당 POD를 누르면 Download됩니다.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLSSOP
4.4 16 1.51 1.26 0.635 POD-MLSSOP-16635(16LD 0.635Pitch)
4.4 20 1.51 1.26 0.635 POD-MLSSOP-20635(20LD 0.635Pitch)
4.4 24 1.51 1.26 0.635 POD-MLSSOP-24635(24LD 0.635Pitch)
4.4 28 1.51 1.26 0.635 POD-MLSSOP-28635(28LD 0.635Pitch)

MLTSSOP POD

*해당 POD를 누르면 Download됩니다.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLTSSOP
4.8 24 1.51 1.26 0.5 POD-MLTSSOP-2405(24LD 0.5Pitch)
4.8 20 1.51 1.26 0.5 POD-MLTSSOP-2805(28LD 0.5Pitch)
4.8 24 1.51 1.26 0.5 POD-MLTSSOP-3005(30LD 0.5Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-08065(8LD 0.65Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-16065(16LD 0.65Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-20065(20LD 0.65Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-24065(24LD 0.65Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-28065(28LD 0.65Pitch)

MLDIP POD

*해당 POD를 누르면 Download됩니다.
pkg type body size lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLDIP
300MIL 8 1.51 1.26 2.54 준비중
14 1.51 1.26 2.54 준비중
16 1.51 1.26 2.54 준비중
18 1.51 1.26 2.54 준비중
24 1.51 1.26 2.54 준비중
600MIL 24 1.51 1.26 2.54 준비중
28 1.51 1.26 2.54 준비중

Open Cavity Package

*해당 POD를 누르면 Download됩니다.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
QFN
3X3 16 0.75 0.55 0.50 MLP3X3-16-OP-01-R4-ECN-10786-1
4X4 20 0.80 0.60 0.50 MLP4X4-20-OP-01-R1-ECN-10607
24 0.80 0.60 0.50 MLP4X4-24-OP-01-R2-ECN-10488
28 0.80 0.60 0.40 QP-QFN28-4MM-0.4MM.pdf
5X5 32 0.80 0.60 0.50 MLP5X5-32-OP-01-R2-ECN-10760
40 0.80 0.60 0.40 QP-QFN40-5MM-0.4MM
40 0.80 0.60 0.40 QP-QFN40-6MM-0.5MM
6X6 40 0.80 0.60 0.50 MLP6X6-40-OP-01-R1-ECN-10627
48 0.80 0.60 0.40 QP-QFN48-6MM-0.4MM
7X7 48 0.80 0.60 0.50 MLP7X7-48-OP-02-R2-ECN-10501
8X8 56 0.80 0.60 0.50 MLP8X8-56-OP-01-R3-ECN-10503
9X9 44 0.80 0.60 0.50 MLP9X9-44-OP-01-R1-ECN-10983
9X9 64 0.80 0.60 0.50 MLP9X9-64-OP-01-R3-ECN-10980
10X10 88 0.80 0.60 0.40 QP-QFN88-10MM-0.4MM
12X12 80 0.80 0.60 0.50 QP-QFN100-12MM-0.4MM
100 0.80 0.60 0.40 MLP12X12-100-OP-03-R5-ECN-11099
DFN 3X3 8 0.75 0.55 0.65 DFN3X3-08-OP-01-R1-ECN-10963
10 0.75 0.55 0.50 DFN3X3-10-OP-01-R1-ECN-10824
LQFP 7X7 48 1.143 0.50 준비중
10X10 64 1.143 0.50 LQFP10X10-64-OP-01-R2-ECN-10542
SOIC 150MIL 8 1.397 0.127 SOIC150-08-OP-01-R3-ECN-10788
14 1.397 0.127 SOIC150-14-OP-01-R2-ECN-10507
16 1.372 0.127 SOIC150-16-OP-01-R4-ECN-10789
300MIL 20 2.286 0.127 SOIC300-20-OP-01-R5-ECN-10791
24 2.362 0.127 SOIC300-24-OP-01-R4-ECN-10792
28 2.286 0.127 SOIC300-28-OP-01-R4-ECN-10793
SOIC(Heat Sink) 150MIL 16 1.372 0.127 SOIC300-16-OP-01H-R3-ECN-10798
300MIL 28 2.286 0.127 SOIC300-28-OP-01H-R3-ECN-10797

Lead Frame (Mold Type)

*해당 POD를 누르면 Download됩니다.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
QFN
4X4 24 0.90 0.70 0.50 POD-QFN-0424 (4x4 24LD)
5X5 32 0.90 0.70 0.50 POD-QFN-0532 (5x5 32LD)
6X6 48 0.90 0.70 0.40 POD-QFN-0648 (6x6 48LD)
7X7 48 0.90 0.70 0.50 POD-QFN-0748 (7x7 48LD)
8X8 68 0.90 0.70 0.40 POD-QFN-0868 (8x8 68LD)
9X9 64 0.90 0.70 0.50 POD-QFN-0964 (9x9 64LD)
COB(Chip On Board) Assembly & Others PKG (Ceramic PKG,CLCC,PGA etc)

Wire Bonder Capability:K&S maxium ultra find pad ptich 40um까지 대응

Assembly Outsourcing
국내 ASS'Y Site 지원

PKG : FBGA, PBGA , FC FBGA, LGA, QFP, WLCSP,Moudle Wafer Bumping (Gold,Solder, Cu Pillar)

해외 ASS'Y Site 지원

PKG : QFP, QFN, SOP류, TSSOP, LGA, DIP, SOT etc..

Wafer Back Grinding(B/G) & SAW

B/G Wafer : 6" 8" 12"INCH (MPW Wafer 포함)

Sawing는 모든 Wafer 가능(Chip 단위 Saw & MPW Wafer Saw)

Chip Sorting (Gel Pack or Waffle Pack) 가능

Others(Assembly Service)
- Wire Bonding Diagram Design
- Substrate(PCB) Design & Artwork
- Unit Laser Marking( Remarking & Add Marking)
- PKG 불량 분석 지원 서비스 (X-RAY, DECAP, PHOTO, etc)