070-4121-5539
KOR
070-4121-5539

Business Field

Business Field assembly

Assembly

We perform sample assembly including MLPGA, LF Mold, Open Cavity, and COB.

Assembly In-house

MLPGA PKG(Multi Land Plastic Grid Array)

JEDEC standard L/F PKG is made of Substrate(PCB) material with same DIMENSION as L/F PKG for SMT,
designed for quick turnaround within 3-4 days during early development stage.

MLFBGA POD

*Click corresponding POD to download.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLFBGA
12X12 180 1.51 1.26 0.80 POD-MLFBGA-12180 (12x12 180Ball 0.8Pitch)
12X12 264 1.51 1.26 0.65 POD-MLFBGA-12264 (12x12 264Ball 0.65Pitch)
12X12 448 1.51 1.26 0.50 POD-MLFBGA-12448 (12x12 448Ball 0.5Pitch)
14X14 400 1.51 1.26 0.65 POD-MLFBGA-14400(14x14 400Ball 0.65Pitch)
15X15 480 1.51 1.26 0.65 POD-MLFBGA-15484(15x15 484Ball 0.65Pitch)

MLQFN POD

*Click corresponding POD to download.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLQFN
4x4 16 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0416 (4x4 16LD)
24 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0424 (4x4 24LD)
28 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0428 (4x4 28LD)
32 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0432 (4x4 32LD)
5X5 20 0.95/1.51 0.7/1.26 0.65 POD-MLQFN-0520 (5x5 20LD)
28 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0528 (5x5 28LD)
32 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0532 (5x5 32LD)
40 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0540 (5x5 40LD)
6X6 20 0.95/1.51 0.7/1.26 0.80 POD-MLQFN-0620 (6x6 20LD)
28 0.95/1.51 0.7/1.26 0.65 POD-MLQFN-0628 (6x6 28LD)
40 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0640 (6x6 40LD)
48 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0648 (6x6 48LD)
56 0.95/1.51 0.7/1.26 0.35 POD-MLQFN-0656 (6x6 56LD)
7X7 20 0.95/1.51 0.7/1.26 1.00 POD-MLQFN-0720 (7x7 20LD)
48 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0748 (7x7 48LD)
56 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0756 (7x7 56LD)
68 0.95/1.51 0.7/1.26 0.35 POD-MLQFN-0768 (7x7 68LD)
8X8 56 0.95/1.51 0.7/1.26 1.00 POD-MLQFN-0856 (8x8 56LD)
68 0.95/1.51 0.7/1.26 0.50 POD-MLQFN-0868 (8x8 68LD)
9X9 76 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-0976 (9x9 76LD)
10X10 88 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-10088 (10x10 88LD)
11X11 100 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-11100 (11x11 100LD)
12X12 100 0.95/1.51 0.7/1.26 0.40 POD-MLQFN-12100 (12x12 100LD)

MLDFN POD

*Click corresponding POD to download.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLDFN
2X2 6 0.95 0.7 0.65 Coming Soon
8 0.95 0.7 0.5 Coming Soon
10 0.95 0.7 0.4 Coming Soon
2X3 6 0.95 0.7 0.65 Coming Soon
8 0.95 0.7 0.5 Coming Soon
10 0.95 0.7 0.4 Coming Soon
3X2 8 0.95 0.7 0.65 Coming Soon
14 0.95 0.7 0.4 Coming Soon
3X3 8 0.95 0.7 0.65 Coming Soon
10 0.95 0.7 0.5 Coming Soon
12 0.95 0.7 0.45 Coming Soon

MLQFP POD

*Click corresponding POD to download.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLQFP
7X7 32 0.95/1.51 0.7/1.26 0.80 POD-MLQFP-0732(7x7 32LD)
48 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-0748(7x7 48LD)
64 0.95/1.51 0.7/1.26 0.40 POD-MLQFP-0764(7x7 64LD)
10X10 52 0.95/1.51 0.7/1.26 0.65 POD-MLQFP-1052(10x10 52LD)
64 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-1064(10x10 64LD)
80 0.95/1.51 0.7/1.26 0.40 POD-MLQFP-1080(10x10 80LD)
14X14 64 0.95/1.51 0.7/1.26 0.80 POD-MLQFP-1464(14x14 64LD)
80 0.95/1.51 0.7/1.26 0.65 POD-MLQFP-1480(14x14 80LD)
100 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-14100(14x14 100LD)
128 0.95/1.51 0.7/1.26 0.40 POD-MLQFP-14128(14x14 128LD)
16X16 120 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-16120(16x16 120LD)
20X20 144 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-20144(20x20 144LD)
144 0.95/1.51 0.7/1.26 0.50 POD-MLQFP-20144H(20x20 144LD Heat Sink)
176 0.95/1.51 0.7/1.26 0.40 POD-MLQFP-20176(20x20 176LD)
24X24 216 1.51 1.26 0.40 POD-MLQFP-24216(24x24 216LD)
28X28 208 1.51 1.26 0.50 POD-MLQFP-28208(28x28 208LD)
256 1.51 1.26 0.40 POD-MLQFP-28256(28x28 256LD)

MLSOP POD

*Click corresponding POD to download.
pkg type body size lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLSOP
150MIL 8 1.51 1.26 1.27 POD-MLSOP-15008(8LD 150MIL)
14 1.51 1.26 1.27 POD-MLSOP-15014(14LD 150MIL)
16 1.51 1.26 1.27 POD-MLSOP-15016(16LD 150MIL)
300MIL 16 1.51 1.26 1.27 POD-MLSOP-30016(16LD 300MIL)
20 1.51 1.26 1.27 POD-MLSOP-30020(20LD 300MIL)
24 1.51 1.26 1.27 POD-MLSOP-30024(24LD 300MIL)
28 1.51 1.26 1.27 POD-MLSOP-30028(28LD 300MIL)
32 1.51 1.26 1.27 POD-MLSOP-30032(32LD 300MIL)

MLSSOP POD

*Click corresponding POD to download.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLSSOP
4.4 16 1.51 1.26 0.635 POD-MLSSOP-16635(16LD 0.635Pitch)
4.4 20 1.51 1.26 0.635 POD-MLSSOP-20635(20LD 0.635Pitch)
4.4 24 1.51 1.26 0.635 POD-MLSSOP-24635(24LD 0.635Pitch)
4.4 28 1.51 1.26 0.635 POD-MLSSOP-28635(28LD 0.635Pitch)

MLTSSOP POD

*Click corresponding POD to download.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLTSSOP
4.8 24 1.51 1.26 0.5 POD-MLTSSOP-2405(24LD 0.5Pitch)
4.8 20 1.51 1.26 0.5 POD-MLTSSOP-2805(28LD 0.5Pitch)
4.8 24 1.51 1.26 0.5 POD-MLTSSOP-3005(30LD 0.5Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-08065(8LD 0.65Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-16065(16LD 0.65Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-20065(20LD 0.65Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-24065(24LD 0.65Pitch)
4.8 28 1.51 1.26 0.65 POD-MLTSSOP-28065(28LD 0.65Pitch)

MLDIP POD

*Click corresponding POD to download.
pkg type body size lead Count pakege Thickness Mold Thickness Lead Pitch POD
MLDIP
300MIL 8 1.51 1.26 2.54 Coming Soon
14 1.51 1.26 2.54 Coming Soon
16 1.51 1.26 2.54 Coming Soon
18 1.51 1.26 2.54 Coming Soon
24 1.51 1.26 2.54 Coming Soon
600MIL 24 1.51 1.26 2.54 Coming Soon
28 1.51 1.26 2.54 Coming Soon

Open Cavity Package

*Click corresponding POD to download.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
QFN
3X3 16 0.75 0.55 0.50 MLP3X3-16-OP-01-R4-ECN-10786-1
4X4 20 0.80 0.60 0.50 MLP4X4-20-OP-01-R1-ECN-10607
24 0.80 0.60 0.50 MLP4X4-24-OP-01-R2-ECN-10488
28 0.80 0.60 0.40 QP-QFN28-4MM-0.4MM
5X5 32 0.80 0.60 0.50 MLP5X5-32-OP-01-R2-ECN-10760
40 0.80 0.60 0.40 QP-QFN40-5MM-0.4MM
40 0.80 0.60 0.40 QP-QFN40-6MM-0.5MM
6X6 40 0.80 0.60 0.50 MLP6X6-40-OP-01-R1-ECN-10627
48 0.80 0.60 0.40 QP-QFN48-6MM-0.4MM
7X7 48 0.80 0.60 0.50 MLP7X7-48-OP-02-R2-ECN-10501
8X8 56 0.80 0.60 0.50 MLP8X8-56-OP-01-R3-ECN-10503
9X9 44 0.80 0.60 0.50 MLP9X9-44-OP-01-R1-ECN-10983
9X9 64 0.80 0.60 0.50 MLP9X9-64-OP-01-R3-ECN-10980
10X10 88 0.80 0.60 0.40 QP-QFN88-10MM-0.4MM
12X12 80 0.80 0.60 0.50 QP-QFN100-12MM-0.4MM
100 0.80 0.60 0.40 MLP12X12-100-OP-03-R5-ECN-11099
DFN 3X3 8 0.75 0.55 0.65 DFN3X3-08-OP-01-R1-ECN-10963
10 0.75 0.55 0.50 DFN3X3-10-OP-01-R1-ECN-10824
LQFP 7X7 48 1.143 0.50 LQFP7X7-48-OP-4801
10X10 64 1.143 0.50 LQFP10X10-64-OP-01-R2-ECN-10542
SOIC 150MIL 8 1.397 0.127 SOIC150-08-OP-01-R3-ECN-10788
14 1.397 0.127 SOIC150-14-OP-01-R2-ECN-10507
16 1.372 0.127 SOIC150-16-OP-01-R4-ECN-10789
300MIL 20 2.286 0.127 SOIC300-20-OP-01-R5-ECN-10791
24 2.362 0.127 SOIC300-24-OP-01-R4-ECN-10792
28 2.286 0.127 SOIC300-28-OP-01-R4-ECN-10793
SOIC(Heat Sink) 150MIL 16 1.372 0.127 SOIC300-16-OP-01H-R3-ECN-10798
300MIL 28 2.286 0.127 SOIC300-28-OP-01H-R3-ECN-10797

Lead Frame (Mold Type)

*Click corresponding POD to download.
pkg type body size(mm) lead Count pakege Thickness Mold Thickness Lead Pitch POD
QFN
4X4 24 0.90 0.70 0.50 POD-QFN-0424 (4x4 24LD)
5X5 32 0.90 0.70 0.50 POD-QFN-0532 (5x5 32LD)
6X6 48 0.90 0.70 0.40 POD-QFN-0648 (6x6 48LD)
7X7 48 0.90 0.70 0.50 POD-QFN-0748 (7x7 48LD)
8X8 68 0.90 0.70 0.40 POD-QFN-0868 (8x8 68LD)
9X9 64 0.90 0.70 0.50 POD-QFN-0964 (9x9 64LD)
COB(Chip On Board) Assembly & Others PKG (Ceramic PKG,CLCC,PGA etc)

Wire Bonder Capability: K&S maximum ultra-fine pad pitch down to 40um support

Assembly Outsourcing
Domestic ASS'Y Site Support

PKG : FBGA, PBGA , FC FBGA, LGA, QFP, WLCSP, Module Wafer Bumping (Gold, Solder, Cu Pillar)

Global ASS'Y Site Support

PKG : QFP, QFN, SOP types, TSSOP, LGA, DIP, SOT etc..

Wafer Back Grinding(B/G) & SAW

B/G Wafer : 6", 8", 12" INCH (including MPW Wafer)

Sawing available for all wafers (Chip-level Saw & MPW Wafer Saw)

Chip Sorting (Gel Pack or Waffle Pack) available

Others(Assembly Service)
- Wire Bonding Diagram Design
- Substrate(PCB) Design & Artwork
- Unit Laser Marking( Remarking & Add Marking)
- PKG Failure Analysis Support Service (X-RAY, DECAP, PHOTO, etc)