070-4121-5539
070-4121-5539
All kinds of Consumer Package
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MLPGA™
MLPGA™ is an all-purpose, versatile semiconductor package independently designed and developed by SNPT. It allows a single substrate to be custom-fabricated into various sizes, lead counts, and package forms per client specifications.
It conforms to standard JEDEC commercial semiconductor packaging specifications, making it fully suitable for electrical testing as well as SMT assembly.
IC reliability evaluations can also be conducted when required.
Designed primarily for early development and research, this package specializes in rapid PKG model selection and short-turnaround manufacturing.
It offers a faster, highly cost-effective, and efficient alternative to traditional sample packaging methods.
The substrate-based MLPGA exposes the exposed die pad on the bottom and connects the PAD and PCB using bonding wires to deliver superior thermal and electrical performance.
Featuring a single, proprietary Multi-Land Plastic Grid Array substrate capable of producing various package types, it serves as a highly cost-effective solution applicable across all semiconductor packaging needs.
PKG Type : Compatible with All PKG types (FBGA, QFN, QFP, SOP, TSSOP, SSOP, DIP)
Versatile lead counts and physical dimensions
Built to full JEDEC compliance
Low-cost solution
Excellent electrical and thermal performance
Radial land structure enables diverse PKG outlines
All kinds of Consumer Package